01643cam a2200433 i 4500 664270530 OCoLC 20250521150803.0 cr mn#nnnaucua 100916t2005 enka gob 101 0 eng c 1852339411 (hardback) 9781852339418 (hardback) 9781846282355 (ebook) YNG eng rda YNG UIAM TK7874 European Conference on Advanced Materials and Processes (8th : 2003 : Lausanne, Switzerland) 607018 Materials for information technology : devices, interconnects and packaging / Ehrenfried Zschech, Caroline Whelan and Thomas Mikolajick (editors) London : Springer, 2005 ©2005 1 online resource (xix, 508 pages) : illustrations text rdacontent computer rdamedia online resource rdacarrier text file PDF rda Engineering materials and processes Selected conference papers. Includes bibliographical references and index. Information technology Congresses 9394 Microelectronics Materials Congresses 215813 Conference proceedings, published Electronic books (Form) 217 Mikolajick, Thomas 607015 Whelan, Caroline, PhD 607016 Zschech, Ehrenfried 607017 Engineering materials and processes 19644 https://link.springer.com/book/10.1007/1-84628-235-7 lcc EBOOK 0 531393 562810 0 0 lcc 0 19 EBOOK IIUM IIUM WEB 2025-05-21 0 eb TK 7874 A38 2003 11100465713 2025-05-21 00:00:00 2025-05-21 EBOOK