TY  - BOOK
AU  - Mikolajick,Thomas
AU  - Whelan,Caroline
AU  - Zschech,Ehrenfried
ED  - European Conference on Advanced Materials and Processes
TI  - Materials for information technology: devices, interconnects and packaging 
T2  - Engineering materials and processes
SN  - 1852339411 (hardback)
AV  - TK7874 
PY  - 2005///
CY  - London
PB  - Springer
KW  - Information technology
KW  - Congresses
KW  - Microelectronics
KW  - Materials
KW  - Conference proceedings, published
KW  - Electronic books (Form)
N1  - Selected conference papers; Includes bibliographical references and index
UR  - https://link.springer.com/book/10.1007/1-84628-235-7
ER  -